Modular liquid-cooled server.
      高性能:雙路Intel?Ice Lake處理器,搭配 80C/160T 海容量:8通道, 最高可達(dá) 3200 MHz DDR4/16DIMM 強(qiáng)擴(kuò)展:高達(dá)4個(gè)雙插槽 GPU,5090/Pro 6000 可用性:支持8個(gè)SATA+4個(gè)U.2

      Application Field

      Scenarios such as high-performance computing, artificial intelligence/deep learning, HPC, cloud gaming, and molecular dynamics simulations

      Product Features

      Technical Specifications

      Product Model 天翱分體式液冷
      CPU 雙路第三代Intel? Xeon? Scalable處理器
      Motherboard Chipset Intel? C621A
      SATA SATA(6Gbps);支持 RAID 0/1/5/10
      RAM 最大內(nèi)存(2DPC 配置):最高4TB 3200MT/s ECC DDR4 RDIMM/LRDIMM
      Number Of RAM Slots 16 DIMM插槽
      Internet 2個(gè)RJ45接口的10GbE網(wǎng)絡(luò)(搭載博通BCM57416芯片)
      Power Supply 2600W
      Power Supply Ccharacteristics ATX電源
      Number Of Power Sources 2個(gè)
      Storage Function 4個(gè)熱插拔3.5英寸SAS/SATA硬盤位
      4個(gè)熱插拔3.5英寸NVMe/SAS/SATA硬盤位
      2個(gè)M.2 NVMe/SATA插槽
      IPMI IPMI 2.0(ASPEEDAST2600)
      PCI-E 4個(gè)PCle4.0x16 FHFL插槽
      2個(gè)PCle4.0x16LP插槽
      1個(gè)PCle4.0x8LP插槽
      System Microsoft Windows Server、Red Hat Enterprise Linux、SUSELinux Enterprise Server、CentOS、Ubuntu。
      Software SuperDoctor? 5、SPM、SUM、SSM、Watchdog、IPMICFG、IPMIView for Linux/Windows、SMCIPMITool、IPMI 2.0
      Temperature 工作溫度:10oC - 35oC(無直接光照情況下);非工作溫度:-40oC - 60oC(限定性配置滿足)
      工作濕度:8% - 90%(非凝結(jié));存儲(chǔ)濕度:5% - 95%(非凝結(jié))。
      Dimensions 660mmx300mmx650mm(長x寬x高)